|Payment & Shipping Terms||Supply Capacity|
|Trade Term:||FOB,CIF||Production Capacity:||4000 per day|
|Payment Terms:||L/C, T/T||Packing:||1pcs/bag,40bag/box,10b...|
|Min. Order:||1000 Piece/Pieces||Delivery Date:||7 days|
|Means of Transport:||Ocean, Air, Land|
1.The HJMT3-10(4008-G/TR) Splicing Module combines a HJM3-25(4008-D/TR) Half-Tap Module with silicon gel. It delivers in place performance withstanding extended exposure to various conditions of extremely high humidity, including water immersion, while maintaining insulation resistance and circuit integrity.It is used for two-wire splicing applications.
2.The Module accepts 0.65-0.32mm(22-28 AWG) solid copper conductors with PIC, pulp or paper insulation diameters 1.65mm(0.065") in the insulation displacement contact(IDC) at both ends of the element.
3.The length is 165mm (6.5"). The width is 15.2mm (0.60"). The crimp Height is 9.8mm (0.39").
4.All materials is suitable for operation in the tropic with maximum temperature up to 70℃.
5.All materials used in the connectors shall be non-toxic and dermatologically safe.
6.Moudle can retain the electrical & mechanical properties in the test report
over working temperature range -30℃ to 70℃ and humidity range of 0% to 95%.
Category: Splicing Modules